The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Apr. 15, 2020
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Masami Suzuki, Kanagawa, JP;

Yoshihito Higashitsutsumi, Kanagawa, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H01L 23/552 (2006.01); H01L 27/146 (2006.01); H04N 9/04 (2006.01); H01L 31/0232 (2014.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 27/14618 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01); H01L 31/02325 (2013.01); H04N 5/2254 (2013.01); H04N 5/2257 (2013.01); H04N 9/04557 (2018.08); H01L 27/14621 (2013.01); H01L 2224/13 (2013.01);
Abstract

An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.


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