IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11387172 B1

PDFFull Text
Date of Patent:
Jul. 12, 2022

Filed:

Feb. 21, 2019

Semiconductor device and method for manufacturing the same

Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Yoshinori Deguchi, Tokyo, JP;

Iwao Natori, Tokyo, JP;

Seiya Isozaki, Tokyo, JP;

Assignee:

RENESAS ELECTRONICS CORPORATION, Tokyo, JP;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Yasser A Abdelaziez

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/532 (2006.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 22/32 (2013.01); H01L 23/53257 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 23/3192 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/0392 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0508 (2013.01); H01L 2224/0558 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05181 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/05186 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05583 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/05681 (2013.01); H01L 2224/05684 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/94 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3512 (2013.01); H01L 2924/37001 (2013.01);
Abstract

A pad is formed on an interlayer insulating film, art insulating film is formed on the interlayer insulating film to cover the pad, and an opening portion exposing a part of the pad is formed in the insulating film. A metal film electrically connected to the pad is formed on the pad exposed from the opening portion and on the insulating film. The metal film integrally includes a first portion on the pad exposed from the opening portion and a second portion on the insulating film. An upper surface of the metal film has a wire bonding region for bonding a wire to the metal film and a probe contact region for bringing the probe into contact with the metal film, the wire bonding region is located on the first portion of the metal film, and the probe contact region is located on the second portion of the metal film.

Find Patent Forward Citations

Loading…