The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

May. 04, 2020
Applicant:

Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);

Inventors:

Feng Zhou, Ann Arbor, MI (US);

Ki Wook Jung, Santa Clara, CA (US);

Ercan M. Dede, Ann Arbor, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/3677 (2013.01); H01L 23/4735 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/3738 (2013.01);
Abstract

A multi-layer cooling structure comprising a first substrate layer comprising an array of cooling channels, a second substrate layer comprising a nozzle structure that includes one or more nozzles, an outlet, and an outlet manifold, a third substrate layer comprising an inlet manifold and an inlet, and one or more TSVs disposed through the first substrate layer, second substrate layer, and third substrate layer. At least one of the one or more TSVs is metallized. The first substrate layer and the second substrate layer are directly bonded, and the second substrate layer and the third substrate layer are directly bonded.


Find Patent Forward Citations

Zhou, Feng. (2022). Multi-layer cooling structure including through-silicon vias through a plurality of directly-bonded substrates and methods of making the same (U.S. Patent No. 11387165). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11387165

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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