The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Jun. 18, 2020
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Yosuke Nakata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 29/16 (2006.01); H01L 23/00 (2006.01); H01L 23/16 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3135 (2013.01); H01L 23/16 (2013.01); H01L 23/293 (2013.01); H01L 23/562 (2013.01); H01L 29/1608 (2013.01);
Abstract

The semiconductor device includes a substrate, a semiconductor element bonded to the substrate, and a sealing resin sealing at least a part of the substrate and the semiconductor element, in which the semiconductor element includes an active region through which a main current flows in an ON state of the semiconductor element, a terminal region surrounding the active region, an anchor film provided on an insulating film of the terminal region, and a protective film covering at least the terminal region including the anchor film, and the anchor film consists of a material different from the insulating film and has a plurality of openings provided discretely.


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