The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
May. 29, 2019
Silicon carbide semiconductor device including a resin covering a silicon carbide semiconductor chip
Sumitomo Electric Industries, Ltd., Osaka, JP;
So Tanaka, Osaka, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
The silicon carbide semiconductor chip includes a silicon carbide substrate, a first insulating film on the silicon carbide substrate, and a second insulating film on the first insulating film. The silicon carbide substrate has a first main surface in contact with the first insulating film, a second main surface, and an outer peripheral surface. The resin covers both of the outer peripheral surface and the second insulating film. The second insulating film has a Young's modulus lower than that of the resin. The second insulating film has a thermal expansion coefficient higher than that of the silicon carbide substrate and higher than that of the resin. The second insulating film includes a first outer peripheral end portion. In a cross section perpendicular to the first main surface, the first outer peripheral end portion is provided along the outer peripheral surface.