The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Feb. 24, 2020
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Rudolf Kogler, Velden, AT;
Juergen Steinbrenner, Noetsch im Gailtal, AT;
Wolfgang Dastel, Villach, AT;
Harald Huetter, Baldramsdorf, AT;
Markus Kahn, Rangersdorf, AT;
Assignee:
INFINEON TECHNOLOGIES AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/687 (2006.01); C23C 16/50 (2006.01); C23C 16/503 (2006.01); C23C 16/505 (2006.01); H01L 21/67 (2006.01); C23C 16/458 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32715 (2013.01); C23C 16/4583 (2013.01); C23C 16/4585 (2013.01); C23C 16/4586 (2013.01); C23C 16/50 (2013.01); C23C 16/503 (2013.01); C23C 16/505 (2013.01); H01J 37/32027 (2013.01); H01J 37/32082 (2013.01); H01J 37/32697 (2013.01); H01L 21/67034 (2013.01); H01L 21/67069 (2013.01); H01L 21/68735 (2013.01); H01L 21/68742 (2013.01); H01L 21/68785 (2013.01); H01J 2237/334 (2013.01); H01J 2237/335 (2013.01); H01J 2237/338 (2013.01); H01J 2237/3321 (2013.01);
Abstract
According to various embodiments, a wafer chuck may include at least one support region configured to support a wafer in a receiving area; a central cavity surrounded by the at least one support region configured to support the wafer only along an outer perimeter; and a boundary structure surrounding the receiving area configured to retain the wafer in the receiving area.