The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Nov. 16, 2017
Applicant:
Nitto Denko Corporation, Ibaraki, JP;
Inventors:
Keisuke Okumura, Osaka, JP;
Yoshihiro Furukawa, Osaka, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 41/04 (2006.01); H01F 1/28 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H05K 1/16 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H01F 41/046 (2013.01); H01F 1/28 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H05K 1/165 (2013.01); H05K 3/20 (2013.01); H01F 2017/0066 (2013.01);
Abstract
A method for producing a module includes a first step of preparing a conductive layer disposed at one side in a thickness direction of a first peeling layer, a second step of forming a conductive pattern from the conductive layer, a third step of pushing the conductive pattern into a first adhesive layer containing a first magnetic particle and a first resin component, and a fourth step of peeling the first peeling layer.