The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Oct. 01, 2020
Applicant:

Neuronbasic Technology Inc., Santa Clara, CA (US);

Inventor:

Raymond Wu, Santa Clara, CA (US);

Assignee:

Neuronbasic Technology, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); G06V 10/147 (2022.01); H04N 5/232 (2006.01);
U.S. Cl.
CPC ...
G06V 10/147 (2022.01); H04N 5/2258 (2013.01); H04N 5/23227 (2018.08);
Abstract

A smart chip assembly capable of communicating with each other and variable array in packaging contains at least two intelligent single-chip, which can be easily formed into a smart chip assembly by cutting after packaging. Each intelligent single-chip has a camera lens module, and each lens module is arranged in a different position and angle to separately obtain images of different angles or depths of field of the object to be recognized, and provide each intelligent single-chip to independently process the image and judge by itself. The result of each judgment based on the obtained images of different angles or depths of field can also be used as one of the options for reference judgment. Then through the mutual communication between the intelligent single-chips, they calculate and analyze different image and image dynamics, and make comprehensive judgments to obtain the best interpretation. Finally, the command is sent to the connected power mechanism to perform corresponding actions to achieve more flexible application and improve the accuracy of identification.


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