The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Aug. 29, 2020
Applicant:

Amatech Group Limited, Spiddal, IE;

Inventors:

Mustafa Lotya, Celbridge, IE;

David Finn, Tourmakeady, IE;

Darren Molloy, Tourmakeady, IE;

Assignee:

AMATECH GROUP LIMITED, County Galway, IE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/06 (2006.01); G06K 19/077 (2006.01); H01Q 1/22 (2006.01); H01Q 21/29 (2006.01); H01Q 7/00 (2006.01); H05K 1/16 (2006.01); H01F 27/28 (2006.01); H05K 3/10 (2006.01); H01F 38/14 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07794 (2013.01); G06K 19/07769 (2013.01); G06K 19/07783 (2013.01); H01Q 1/2216 (2013.01); H01Q 1/2225 (2013.01); H01Q 1/2283 (2013.01); H01Q 7/00 (2013.01); H01Q 21/29 (2013.01); H05K 1/165 (2013.01); H01F 27/2804 (2013.01); H01F 38/14 (2013.01); H05K 3/103 (2013.01); H05K 2201/10098 (2013.01); Y10T 29/49018 (2015.01); Y10T 29/49162 (2015.01);
Abstract

A capacitive coupling enhanced (CCE) transponder chip module (TCM) comprises an RFID chip (CM, IC), optionally contact pads (CP), a module antenna (MA), and a coupling frame (CF), all on a common substrate or module tape (MT). The coupling frame (CF,A) may be in the form of a ring, having an inner edge (IE), an outer edge IE,) and a central opening (OP), disposed closely adjacent to and surrounding the module antenna (MA). A slit (S) may extend from the inner edge (IE) to the outer edge (OE) of the coupling frame (CF) so that the coupling frame (CF) is 'open loop'. An RFID device may comprise a transponder chip module (TCM) having a module antenna (MA), a device substrate (DS), and an antenna structure (AS) disposed on the device substrate (DS) and connected with the module antenna (MA). A portion of a conductive layer (CL,) remaining after etching a module antenna (MA) may be segmented to have several smaller isolated conductive structures.


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