The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Mar. 18, 2021
Fujifilm Corporation, Tokyo, JP;
Takeshi Narita, Kanagawa, JP;
FUJIFILM Corporation, Tokyo, JP;
Abstract
A conductive member is provided including a substrate, an interlayer disposed on at least one surface of the substrate, a patterned plating target layer disposed in the form of a mesh on the interlayer having a functional group interacting with a plating catalyst or a precursor thereof, a mesh-shaped metal layer that is disposed on the patterned plating target layer and includes a plurality of crossing thin metal wires, and a protective layer disposed on the metal layer. In a case where 'a' represents a modulus of elasticity of the substrate at 25° C. and 'b' represents a modulus of elasticity of the interlayer at 25° C., the conductive member satisfies the following Formula A, Formula A: 0.010≤b/a≤0.500, an area ratio of the metal layer is 0.2% to 60%, and a modulus of elasticity of the protective layer at 25° C. is 0.10 to 5.00 GPa.