The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Jan. 29, 2021
Applicant:

Atmospheric Plasma Solutions, Inc., Cary, NC (US);

Inventor:

Peter Joseph Yancey, Cary, NC (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 8/36 (2006.01); H05H 1/24 (2006.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01); B32B 37/12 (2006.01); C23C 8/12 (2006.01); C23C 8/24 (2006.01);
U.S. Cl.
CPC ...
C23C 8/36 (2013.01); B32B 7/12 (2013.01); B32B 15/04 (2013.01); B32B 37/12 (2013.01); C23C 8/12 (2013.01); C23C 8/24 (2013.01); H05H 1/2406 (2013.01); B32B 2255/06 (2013.01); B32B 2255/20 (2013.01);
Abstract

An adhesion promoting layer is formed on a metallic substrate by generating a non-thermal plasma in air at atmospheric pressure, and exposing a surface of the metallic substrate to the plasma. The plasma oxidizes the metallic substrate to form metal oxide from metal atoms of the metallic substrate. The metal oxide is formed as a metal oxide layer disposed directly on an underlying bulk metallic layer of the metallic substrate. Alternatively, the plasma nitridizes the metallic substrate to form metal nitride from metal atoms of the metallic substrate. The metal nitride is formed as a metal nitride layer disposed directly on an underlying bulk metallic layer of the metallic substrate.


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