The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Nov. 18, 2016
Applicant:

National Health Research Institutes, Zhunan Town, TW;

Inventors:

Chia-Hsien S. Hsu, Zhunan Town, TW;

Ching-Hui Lin, Zhunan Town, TW;

Duane S. Juang, Zhunan Town, TW;

Hao-Chen Chang, Zhunan Town, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C12M 3/06 (2006.01); B01L 3/00 (2006.01); C12M 1/32 (2006.01); C12M 1/00 (2006.01); C12M 1/26 (2006.01); C12M 1/16 (2006.01);
U.S. Cl.
CPC ...
C12M 23/16 (2013.01); B01L 3/502707 (2013.01); B01L 3/502715 (2013.01); B01L 3/502761 (2013.01); C12M 1/165 (2013.01); C12M 1/265 (2013.01); C12M 23/12 (2013.01); C12M 23/32 (2013.01); C12M 23/50 (2013.01); C12M 29/00 (2013.01); C12M 33/00 (2013.01); C12M 33/04 (2013.01); C12M 99/00 (2013.01); B01L 2200/0647 (2013.01); B01L 2300/0829 (2013.01); B01L 2300/0887 (2013.01); B01L 2300/12 (2013.01); B01L 2300/16 (2013.01);
Abstract

A target particle transferring device is disclosed, which comprises: (a) a substrate with a thickness of T and a width of W, having top and bottom portions, the top portion having a top surface and the bottom portion having a bottom surface; (b) a notch structure formed in the bottom portion of the substrate, comprising: a groove with a width of W, located at a distance oft below the top surface of the substrate, wherein the groove is formed in the bottom portion from the bottom surface extending toward the top portion; and (c) a target substrate portion with a width of Wand a thickness of T, located in the top and bottom portions of the substrate and being surrounded by the groove. Methods of transferring a target particle from one device to another is also disclosed.


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