The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Apr. 18, 2017
Applicant:
Purdue Research Foundation, West Lafayette, IN (US);
Inventors:
Kenneth Henry Sandhage, West Lafayette, IN (US);
Asegun Sekou Henry, Atlanta, GA (US);
Assignee:
Purdue Research Foundation, West Lafayette, IN (US);
Primary Examiner:
Int. Cl.
CPC ...
C04B 41/51 (2006.01); C04B 35/01 (2006.01); C04B 35/547 (2006.01); C04B 41/88 (2006.01); B32B 3/30 (2006.01); B32B 3/26 (2006.01); B32B 18/00 (2006.01); F28F 3/00 (2006.01); F28F 3/04 (2006.01); F28F 3/12 (2006.01); C04B 35/56 (2006.01); C04B 37/00 (2006.01); C04B 41/00 (2006.01); C22C 1/10 (2006.01); C22C 29/06 (2006.01); C04B 38/00 (2006.01); C04B 35/58 (2006.01); C04B 35/76 (2006.01); F03G 6/06 (2006.01); F24S 80/10 (2018.01); C04B 35/632 (2006.01); C04B 35/638 (2006.01); C04B 35/657 (2006.01); C04B 41/50 (2006.01); C04B 41/87 (2006.01); C09K 5/14 (2006.01); C22C 29/08 (2006.01);
U.S. Cl.
CPC ...
C04B 35/5622 (2013.01); C04B 35/547 (2013.01); C04B 35/56 (2013.01); C04B 35/58 (2013.01); C04B 35/632 (2013.01); C04B 35/638 (2013.01); C04B 35/657 (2013.01); C04B 35/76 (2013.01); C04B 37/001 (2013.01); C04B 37/003 (2013.01); C04B 38/00 (2013.01); C04B 41/009 (2013.01); C04B 41/5025 (2013.01); C04B 41/51 (2013.01); C04B 41/5133 (2013.01); C04B 41/87 (2013.01); C04B 41/88 (2013.01); C09K 5/14 (2013.01); C22C 1/1036 (2013.01); C22C 29/06 (2013.01); C22C 29/067 (2013.01); C22C 29/08 (2013.01); F03G 6/06 (2013.01); F24S 80/10 (2018.05); C04B 2235/3839 (2013.01); C04B 2235/3847 (2013.01); C04B 2235/40 (2013.01); C04B 2235/404 (2013.01); C04B 2235/405 (2013.01); C04B 2235/407 (2013.01); C04B 2235/428 (2013.01); C04B 2235/604 (2013.01); C04B 2235/616 (2013.01); C04B 2235/6562 (2013.01); C04B 2235/6583 (2013.01); C04B 2235/77 (2013.01); C04B 2235/96 (2013.01); C04B 2235/9607 (2013.01); C04B 2237/36 (2013.01); C04B 2237/365 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/38 (2013.01); C04B 2237/40 (2013.01); C04B 2237/60 (2013.01); C04B 2237/61 (2013.01); C04B 2237/62 (2013.01); Y02E 10/46 (2013.01);
Abstract
Thermally-conductive ceramic and ceramic composite components suitable for high temperature applications, systems having such components, and methods of manufacturing such components. The thermally-conductive components are formed by a displacive compensation of porosity (DCP) process and are suitable for use at operating temperatures above 600° C. without a significant reduction in thermal and mechanical properties.