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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11383497 B1

PDFFull Text
Date of Patent:
Jul. 12, 2022

Filed:

Oct. 17, 2017

Co-injection-molded multilayer structure

Applicant:

Kuraray Co., Ltd., Kurashiki, JP;

Inventors:

Edgard Chow, Houston, TX (US);

Gene Medlock, Houston, TX (US);

Wataru Hirose, Houston, TX (US);

Assignee:

KURARAY CO., LTD., Kurashiki, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Yan Lan

Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 1/02 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B29C 45/16 (2006.01); B65D 65/40 (2006.01); B29K 23/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B29C 45/16 (2013.01); B32B 1/02 (2013.01); B32B 27/306 (2013.01); B32B 27/32 (2013.01); B65D 65/40 (2013.01); B29K 2023/086 (2013.01); B29K 2023/12 (2013.01); B29K 2995/0067 (2013.01); B29L 2031/712 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2307/7244 (2013.01); B32B 2439/70 (2013.01);
Abstract

There is provided a co-injection-molded multilayer structure having a barrier layer and outer layers laminated on both sides of the barrier layer, wherein the barrier layer is made of a resin composition comprising an ethylene-vinyl alcohol copolymer (A) and an alkali metal salt (B) of a higher fatty acid having a melting point of 250° C. or lower; a content of the alkali metal salt (B) in the barrier layer is 50 to 1500 ppm in terms of metal atoms; and the outer layers are made of a resin composition comprising an unmodified polypropylene (E) and a maleic anhydride-modified polypropylene (F) having a lower melt viscosity than that of the unmodified polypropylene (E). Although it has no adhesive layers, the co-injection-molded multilayer structure exhibits excellent adhesiveness between the barrier layer made of an EVOH resin composition and the outer layer made of a polypropylene resin composition.

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