The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Nov. 01, 2018
Applicant:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Inventors:

Sota Kamo, Tokyo, JP;

Kiyoka Takagi, Tokyo, JP;

Naomoto Ishikawa, Tokyo, JP;

Hideki Horizono, Tokyo, JP;

Wataru Nishimura, Tokyo, JP;

Toshiyuki Takayanagi, Tokyo, JP;

Nobuyuki Kamihara, Tokyo, JP;

Naoaki Fujiwara, Tokyo, JP;

Tsukasa Katsumata, Tokyo, JP;

Kazuki Ohashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/22 (2006.01); B29C 70/46 (2006.01); B29K 105/08 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 70/222 (2013.01); B29C 70/46 (2013.01); B29K 2105/0845 (2013.01); B29L 2031/001 (2013.01);
Abstract

A desired shape can be easily realized, and a decrease in strength can be inhibited. A method for producing a composite material includes: an insertion step of inserting an inner member in which a second reinforcing fiber is impregnated with a resin into a space of an outer member that is formed of a woven first reinforcing fiber extending in an undulating manner, the outer member including an opening that is provided at at least one end portion and the space that communicates with the opening; and a composite material forming step of forming a composite material in which the outer member and the inner member are joined to each other by curing the resin of the inner member to join the outer member and the inner member to each other.


Find Patent Forward Citations

Loading…