The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Oct. 02, 2019
National Cheng Kung University, Tainan, TW;
Haw-Ching Yang, Tainan, TW;
Yu-Lung Lo, Tainan, TW;
Hung-Chang Hsiao, Tainan, TW;
Shyh-Hau Wang, Tainan, TW;
Min-Chun Hu, Tainan, TW;
Chih-Hung Huang, Tainan, TW;
Fan-Tien Cheng, Tainan, TW;
NATIONAL CHENG KUNG UNIVERSITY, Tainan, TW;
Abstract
An additive manufacturing (AM) system, an AM method, and an AM feature extraction method are provided. The AM system includes an AM tool, a product metrology system, an in-situ metrology system, a virtual metrology (VM) system, a compensator, a track planner, a controller, a simulator and an augmented reality (AR) device. The simulator is used to find feasible parameter ranges, while the AR device is used to support operations and maintenance of the AM tool. The product metrology system, the in-situ metrology system and the VM system are integrated to estimate the variation of material on a powder bed of the AM tool. The compensator is used for compensating the process variation by adjusting process parameters. The product metrology system is used to measure the quality of products. The in-situ metrology system is used to collect features of melt pools on the powder bed.