The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Sep. 24, 2020
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/153 (2017.01); B33Y 30/00 (2015.01); B33Y 10/00 (2015.01); B29C 64/165 (2017.01); B33Y 50/02 (2015.01); B29C 64/393 (2017.01); B29C 64/291 (2017.01); B22F 10/20 (2021.01); B22F 10/30 (2021.01); B22F 10/36 (2021.01); B22F 10/14 (2021.01); B22F 10/38 (2021.01); B22F 10/28 (2021.01); B22F 10/366 (2021.01); B22F 10/10 (2021.01); B29C 64/124 (2017.01);
U.S. Cl.
CPC ...
B29C 64/153 (2017.08); B29C 64/165 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B22F 10/10 (2021.01); B22F 10/14 (2021.01); B22F 10/20 (2021.01); B22F 10/28 (2021.01); B22F 10/30 (2021.01); B22F 10/36 (2021.01); B22F 10/366 (2021.01); B22F 10/38 (2021.01); B29C 64/124 (2017.08); B29C 64/291 (2017.08); B29C 64/393 (2017.08); Y02P 10/25 (2015.11);
Abstract
In an example implementation, a method of printing a multi-structured three-dimensional (3D) object includes forming a layer of sinterable material. The method includes processing a first portion of the sinterable material using a first set of processing parameters and processing a second portion of the sinterable material using a second set of processing parameters. The processed first and second portions form, respectively, parts of a first and second structure of a multi-structured 3D object.