The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Sep. 21, 2020
Applicant:

Aptiv Technologies Limited, St. Michael, BB;

Inventors:

Stephen C. Antaya, West Kingston, RI (US);

William Falk, Warwick, RI (US);

Justin Amalfitano, East Providence, RI (US);

Amit Datta, East Greenwich, RI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); C22C 30/06 (2006.01); C22C 30/04 (2006.01); C22C 13/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); C22C 13/00 (2013.01); C22C 30/04 (2013.01); C22C 30/06 (2013.01);
Abstract

An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer.


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