The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Oct. 26, 2017
Applicants:

Shin-etsu Polymer Co., Ltd., Tokyo, JP;

National University Corporation Saitama University, Saitama, JP;

Inventors:

Junichi Ikeno, Saitama, JP;

Yohei Yamada, Saitama, JP;

Hideki Suzuki, Saitama, JP;

Rika Matsuo, Saitama, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/53 (2014.01); B23K 26/064 (2014.01); C01B 32/956 (2017.01); C09K 13/02 (2006.01); C30B 29/36 (2006.01); C30B 33/04 (2006.01); C30B 33/10 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
B23K 26/53 (2015.10); B23K 26/064 (2015.10); C01B 32/956 (2017.08); C09K 13/02 (2013.01); C30B 29/36 (2013.01); C30B 33/04 (2013.01); C30B 33/10 (2013.01); H01L 21/02019 (2013.01);
Abstract

A method for manufacturing a peeled substrate has a laser condensing step for focusing laser light at a prescribed depth from the surface of a substrate and a positioning step for moving and positioning a laser condenser relative to the substrate, the method involving forming a processed layer in the substrate. The laser condensing step includes a laser light adjustment step in which a diffraction optical element is used to branch the laser light into a plurality of branched laser beams, and at least one of the branched laser beams is branched such that the intensity thereof differs from the other branched laser beams. The processed layer is elongated using the branched laser beam having a relatively high intensity among the plurality of branched laser beams to process the substrate, and the elongation of the processed layer is restrained using the branched laser beams having a relatively low intensity.


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