The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

May. 28, 2018
Applicants:

Ihi Aerospace Co., Ltd., Tokyo, JP;

Japan Aerospace Exploration Agency, Tokyo, JP;

Inventors:

Ideo Masuda, Ibaraki, JP;

Toshiki Kato, Ibaraki, JP;

Takuma Inoue, Tokyo, JP;

Masahiro Sasaki, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/342 (2014.01); F02K 9/64 (2006.01); F28D 7/10 (2006.01); F28F 21/08 (2006.01); B23K 101/14 (2006.01);
U.S. Cl.
CPC ...
B23K 26/342 (2015.10); F02K 9/64 (2013.01); F28D 7/10 (2013.01); F28F 21/085 (2013.01); B23K 2101/14 (2018.08); F05D 2230/31 (2013.01);
Abstract

A heat transfer bodyis prepared. The heat transfer bodyforms an inner spacefor existence of one of a higher-temperature fluid or a lower-temperature fluid. The heat transfer bodyconstitutes a heat exchanger, and is formed of a copper material as a wall surrounding the inner space. In the wall, a flow path through which the other of the higher-temperature fluid and the lower-temperature fluid flows is formed. By LMD treatment, an LMD layer is formed directly on an outer circumferential surfaceof the heat transfer body. In the LMD treatment, a metal material is supplied to a supply position on the outer circumferential surface, and the supply position is irradiated with laser light to form an LMD layer. An energy density of the laser light is set to melt both the metal material and the outer circumferential surface


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