The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2022
Filed:
Jun. 21, 2018
Applicant:
Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;
Inventors:
Alexander Rogg, Trabitz, DE;
Bogdan Lisca, Sanmihaiu Roman, RO;
Assignee:
Heraeus Deutschland GmbH & Co. KG, Hanau, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/0622 (2014.01); B23K 26/402 (2014.01); C04B 37/02 (2006.01); H05K 3/00 (2006.01); H05K 1/03 (2006.01); B23K 103/18 (2006.01); B23K 103/12 (2006.01); B23K 103/00 (2006.01); H05K 3/08 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0624 (2015.10); B23K 26/402 (2013.01); C04B 37/02 (2013.01); H05K 1/0306 (2013.01); H05K 3/0029 (2013.01); B23K 2103/12 (2018.08); B23K 2103/18 (2018.08); B23K 2103/52 (2018.08); C04B 37/026 (2013.01); C04B 2237/30 (2013.01); C04B 2237/32 (2013.01); C04B 2237/40 (2013.01); C04B 2237/50 (2013.01); H05K 1/03 (2013.01); H05K 3/08 (2013.01);
Abstract
The present application relates to a method of laser ablation of a metal-ceramic substrate, in which a laser is used under process conditions in which the formation of solid metal particles on the metal-ceramic substrate, which can separate from metal particles released by laser ablation near the ablation edge, is essentially avoided. Further the present application relates to a ceramic-metal substrate comprising a ceramic substrate and a metallization on at least one side of the ceramic substrate, wherein the ceramic substrate and the metallization have flush cutting edge.