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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11383306 B1

PDFFull Text
Date of Patent:
Jul. 12, 2022

Filed:

Sep. 12, 2017

Method for producing polycrystalline diamond body, polycrystalline diamond body, cutting tool, wear-resistance tool and grinding tool

Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Yuh Ishida, Itami, JP;

Hitoshi Sumiya, Itami, JP;

Assignee:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Attorneys:

Baker Botts L.L.P.

Michael A. Sartori

Primary Examiner:

Pegah Parvini

Assistant Examiner:

Ross J Christie

Int. Cl.
CPC ...
B23B 27/20 (2006.01); C01B 32/26 (2017.01); C04B 35/52 (2006.01); B23B 51/00 (2006.01); C04B 35/645 (2006.01); B23F 21/00 (2006.01); B23C 5/16 (2006.01); B23D 77/00 (2006.01); C04B 35/626 (2006.01); B24D 3/00 (2006.01); B23G 5/06 (2006.01); C04B 35/528 (2006.01); B23B 27/14 (2006.01);
U.S. Cl.
CPC ...
B23B 27/20 (2013.01); B23B 27/14 (2013.01); B23B 51/00 (2013.01); B23C 5/16 (2013.01); B23D 77/00 (2013.01); B23F 21/00 (2013.01); B23G 5/06 (2013.01); B24D 3/00 (2013.01); C01B 32/26 (2017.08); C04B 35/522 (2013.01); C04B 35/528 (2013.01); C04B 35/62675 (2013.01); C04B 35/645 (2013.01); C01P 2004/51 (2013.01); C01P 2004/54 (2013.01); C01P 2004/64 (2013.01); C04B 2235/425 (2013.01); C04B 2235/427 (2013.01); C04B 2235/528 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/5454 (2013.01); C04B 2235/5463 (2013.01); C04B 2235/781 (2013.01); C04B 2235/80 (2013.01); C04B 2235/96 (2013.01);
Abstract

Provided is a method for producing a polycrystalline diamond body, the method including a first step of heat-treating a powder of high-pressure-phase carbon at higher than or equal to 1300° C. to obtain a heat-treated carbon powder, and a second step of sintering the heat-treated carbon powder under conditions of greater than or equal to 12 GPa and less than or equal to 25 GPa and higher than or equal to 1200° C. and lower than or equal to 2300° C. to obtain a polycrystalline diamond body.

Find Patent Forward Citations

Ishida, Yuh. (2022). Method for producing polycrystalline diamond body, polycrystalline diamond body, cutting tool, wear-resistance tool and grinding tool (U.S. Patent No. 11383306). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11383306

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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