The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Nov. 12, 2018
Applicant:

Christopher Walker, Palo Alto, CA (US);

Inventor:

Christopher Walker, Palo Alto, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); B01L 7/00 (2006.01); C12Q 1/686 (2018.01);
U.S. Cl.
CPC ...
B01L 3/502715 (2013.01); B01L 3/502738 (2013.01); B01L 7/52 (2013.01); B01L 2200/04 (2013.01); B01L 2200/147 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/1827 (2013.01); B01L 2300/1894 (2013.01); C12Q 1/686 (2013.01);
Abstract

Techniques are provided for a microfluidic chip for performing a microfluidic reaction. The microfluidic chip includes a rigid layer, a first polymer layer that forms a first surface of a microfluidic chamber within the microfluidic chip, a first adhesive layer disposed between the rigid layer and the first polymer layer, and a second polymer layer that forms a second surface of the microfluidic chamber, and a first port connecting an exterior of the microfluidic chip to the microfluidic chamber through at least the rigid layer, the first polymer layer, and the first adhesive layer. A first self-sealing valve is formed in the first polymer layer and disposed within the first port, the first self-sealing valve configured to seal directly against the rigid layer through a first gap in the first adhesive layer in response to pressure from thermal expansion of a fluid within the microfluidic chamber.


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