The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Jan. 11, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jong Keun Song, Yongin-si, KR;

Tae Ho Jeon, Seoul, KR;

Assignee:

SAMSUNG MEDISON CO., LTD., Hongcheon-gun, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 8/00 (2006.01); A61B 8/14 (2006.01); A61B 8/08 (2006.01);
U.S. Cl.
CPC ...
A61B 8/54 (2013.01); A61B 8/145 (2013.01); A61B 8/4405 (2013.01); A61B 8/4488 (2013.01); A61B 8/483 (2013.01); A61B 8/4444 (2013.01); A61B 8/4494 (2013.01);
Abstract

An ultrasound probe, including a transducer module configured to receive an echo ultrasound signal reflected from a subject in response to a transmitted ultrasound signal, and a driver chip provided in the transducer module, the driver chip being configured to focus at least one of the ultrasound signal and the echo ultrasound signal, wherein the driver chip includes a fine analog beamformer configured to apply a fine delay and a coarse analog beamformer configured to apply a coarse delay, wherein the fine analog beamformer is arranged in a first inner region of a plurality of inner regions of the driver chip, the first inner region being located opposite to the transducer module, and wherein the coarse analog beamformer is arranged in a second inner region of the plurality of inner regions of the driver chip, the second inner region being different from the first inner region.


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