The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2022
Filed:
May. 24, 2019
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01); H01L 21/02 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/34 (2006.01); H01L 23/52 (2006.01); H01L 23/495 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4626 (2013.01); H05K 3/4069 (2013.01); H05K 3/4614 (2013.01); H05K 3/4623 (2013.01); H05K 3/4655 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/09209 (2013.01); H05K 2203/1189 (2013.01);
Abstract
In a printed wiring board, when a plurality of wiring base bodies are collectively stacked, a constituent material of a first layer of an insulating resin film has a low melting point, so that the first layer is easily melted. Therefore, thermal welding on an upper surface of the wiring base body is reliably performed, and the wiring base bodies are bonded to each other with high reliability.