The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Apr. 17, 2020
Applicant:

Alps Alpine Co., Ltd., Tokyo, JP;

Inventors:

Hideto Sasagawa, Niigata-ken, JP;

Takashi Asakawa, Niigata-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G06F 3/044 (2006.01); H05K 1/11 (2006.01); G06F 3/041 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0281 (2013.01); G06F 3/044 (2013.01); G06F 3/04164 (2019.05); H05K 1/118 (2013.01); G06F 2203/04102 (2013.01); H05K 1/09 (2013.01); H05K 2201/09081 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/2009 (2013.01);
Abstract

An input device includes a support base, a sensor unit including electrode portions, an extended portion extending outward from the support base, a lead-out wire in conduction with the electrode portions, a grounding wire adjacent to the lead-out wire, the lead-out wire and the grounding wire being along a first major surface of the extended portion, and a reinforcement plate on a part of a second major surface opposite to the first major surface and on the side of the support base from the tip. When viewed from a normal direction of the second major surface, the grounding wire is greater than the lead-out wire, an end-portion projection line formed by a support-base-side end portion of the reinforcement plate is nonlinear, and a most-protruding location in the end-portion projection line closest to the support base overlaps the grounding wire.


Find Patent Forward Citations

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Sasagawa, Hideto. (2022). Input device with reinforcement plate and wider grounding wire (U.S. Patent No. 11382212). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11382212

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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