The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2022
Filed:
Dec. 17, 2020
International Business Machines Corporation, Armonk, NY (US);
John R. Dangler, Rochester, MN (US);
Arthur J Higby, Cottekill, NY (US);
Philipp K Buchling Rego, Wappingers Falls, NY (US);
David Clifford Long, Wappingers Falls, NY (US);
James Busby, New Paltz, NY (US);
Matthew Doyle, Chatfield, MN (US);
Edward N. Cohen, Kingston, NY (US);
Michael Fisher, Poughkquag, NY (US);
William Santiago-Fernandez, Hopewell Junction, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
A uniform thickness flex circuit is taught that uses more than one dielectric layer. A first dielectric layer is more flexible and capable of reliably bending at a radius of curvature at which a second dielectric layer cannot be reliably bent. The second dielectric layer has at least one more desirable electrical characteristic than the first dielectric area, for example leakage. Use of the uniform thickness flex circuit to protect sensitive material in an electronic enclosure is also described.