The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Feb. 27, 2020
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Kiyokazu Itoi, Osaka, JP;

Takeru Tamari, Osaka, JP;

Daisuke Sakurai, Osaka, JP;

Shozo Ochi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/369 (2011.01); H01L 27/146 (2006.01); H04N 5/225 (2006.01); A61B 1/04 (2006.01); A61B 1/05 (2006.01); G02B 23/24 (2006.01);
U.S. Cl.
CPC ...
H04N 5/369 (2013.01); H01L 27/14607 (2013.01); H01L 27/14618 (2013.01); H01L 27/14683 (2013.01); H04N 5/2252 (2013.01); H04N 5/2257 (2013.01); A61B 1/04 (2013.01);
Abstract

A solid-state imaging device includes a solid-state imaging element and a substrate fixed to the solid-state imaging element by a sealing resin on a surface on an opposite side of a light receiving surface of the solid-state imaging element, an outer edge of the substrate seen from the light receiving surface side of the solid-state imaging element is positioned within an outer edge of the solid-state imaging element and an outer edge of the sealing resin seen from the light receiving surface side of the solid-state imaging element is positioned within the outer edge of the solid-state imaging element. The sealing resin includes a first sealing resin and a second sealing resin not contacting the first sealing resin to seal the components.


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