The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Jul. 30, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Patryk Gumann, Tarrytown, NY (US);

Salvatore B. Olivadese, Stamford, CT (US);

Markus Brink, White Plains, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01P 1/203 (2006.01); G06N 10/00 (2022.01); H01L 23/34 (2006.01); H01P 1/20 (2006.01); H01P 11/00 (2006.01); H01R 13/66 (2006.01); H04B 3/56 (2006.01);
U.S. Cl.
CPC ...
H01P 1/20327 (2013.01); G06N 10/00 (2019.01); H01L 23/345 (2013.01); H01P 1/20 (2013.01); H01P 11/003 (2013.01); H01R 13/66 (2013.01); H04B 3/56 (2013.01);
Abstract

An on-chip microwave filter circuit includes a substrate formed of a first material that exhibits at least a threshold level of thermal conductivity, wherein the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The filter circuit further includes a dispersive component configured to filter a plurality of frequencies in an input signal, the dispersive component including a first transmission line disposed on the substrate, the first transmission line being formed of a second material that exhibits at least a second threshold level of thermal conductivity, where the second threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The dispersive component further includes a second transmission line disposed on the substrate, the second transmission line being formed of the second material.


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