The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Aug. 31, 2020
Applicant:

Azur Space Solar Power Gmbh, Heilbronn, DE;

Inventors:

Steffen Sommer, Tamm, DE;

Wolfgang Koestler, Heilbronn, DE;

Alexander Frey, Heilbronn, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 31/0475 (2014.01); H01L 21/78 (2006.01); B23K 26/364 (2014.01); H01L 31/0687 (2012.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 31/186 (2013.01); B23K 26/364 (2015.10); H01L 21/78 (2013.01); H01L 31/0475 (2014.12); H01L 31/0687 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08);
Abstract

A dicing method for separating a wafer comprising a plurality of solar cells stack along at least one parting line, at least having the steps of: providing the wafer with a top, a bottom, an adhesive layer which is integrally bonded with the top and a cover glass layer which is integrally bonded with the adhesive layer, wherein the wafer includes a plurality of solar cell stacks, each having a germanium substrate layer forming the bottom of the wafer, a germanium sub-cell and at least two III-V sub-cells; creating a separating trench along the parting line by means of laser ablation, which extends from a bottom of the wafer through the wafer and the adhesive layer at least up to a top of the cover glass layer; and dividing the cover glass layer along the separating trench.


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