The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2022
Filed:
Jun. 12, 2020
Applicant:
Tianma Japan, Ltd., Kanagawa, JP;
Inventors:
Kazushige Takechi, Kanagawa, JP;
Jun Tanaka, Kanagawa, JP;
Kenji Sera, Xiamen, CN;
Yong Yuan, Xiamen, CN;
Assignees:
WUHAN TIANMA MICRO-ELECTRONICS CO., LTD., Wuhan, CN;
TIANMA JAPAN, LTD., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/786 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78651 (2013.01); H01L 21/02631 (2013.01); H01L 29/4908 (2013.01); H01L 29/6675 (2013.01); H01L 29/78618 (2013.01);
Abstract
A thin-film device includes a polysilicon element and an oxide semiconductor element. The polysilicon element includes a first part made of low-resistive polysilicon. The oxide semiconductor element includes a second part made of low-resistive oxide semiconductor. The first part and the second part are disposed to overlap each other and connected.