The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2022
Filed:
Jan. 16, 2020
Applicant:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Inventors:
Assignee:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/3205 (2006.01); H01L 23/367 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/32051 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3121 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/16225 (2013.01);
Abstract
A semiconductor chip is mounted on a substrate in a face-down manner. A metal film is arranged on a back surface of the semiconductor chip facing an opposite side from the substrate away from an edge of the back surface. A sealing resin layer seals the semiconductor chip with a part of the metal film being exposed from the sealing resin layer.
Kurokawa, Atsushi. (2022). Semiconductor device and method for manufacturing semiconductor device (U.S. Patent No. 11380601). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11380601
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile