The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2022
Filed:
Oct. 27, 2020
Applicant:
SK Hynix Inc., Icheon-si, KR;
Inventor:
Hyun Chul Seo, Icheon-si, KR;
Assignee:
SK hynix Inc., Icheon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/66 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); H01L 23/3171 (2013.01); H01L 25/0657 (2013.01); H01L 21/78 (2013.01); H01L 23/293 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01);
Abstract
A semiconductor wafer includes a first chip region and a second chip region spaced apart from each other by a scribe lane region. The semiconductor wafer also includes a test pad disposed in the scribe lane region. The semiconductor wafer additionally includes a protective layer partially covering the first chip region, the second chip region, and the scribe lane region, wherein the protective layer covers a portion of the test pad adjacent to the first chip region and leaves a remaining portion of the first test pad exposed.