The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2022
Filed:
Jul. 18, 2018
Iwatani Corporation, Osaka, JP;
Hamamatsu Photonics K.k., Shizuoka, JP;
Toshiki Manabe, Tokyo, JP;
Takehiko Senoo, Amagasaki, JP;
Koichi Izumi, Amagasaki, JP;
Tadashi Shojo, Amagasaki, JP;
Takafumi Ogiwara, Hamamatsu, JP;
Takeshi Sakamoto, Hamamatsu, JP;
IWATANI CORPORATION, Osaka, JP;
HAMAMATSU PHOTONICS K.K., Hamamatsu, JP;
Abstract
A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, forming a groove in the workpiece along an intended cut line. In the forming a groove, a first dry etching process is performed from a front surface toward a rear surface of the workpiece. After the first dry etching process, a first pressure-reducing process is performed in which the workpiece is placed under an atmosphere of reduced pressure as compared to pressure during the first dry etching process. After the first pressure-reducing process, a second dry etching process is performed from the front surface toward the rear surface of the workpiece.