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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11380537 B1

PDFFull Text
Date of Patent:
Jul. 05, 2022

Filed:

Feb. 01, 2019

Method of manufacturing a semiconductor device and a cleaning composition for an adhesive layer

Applicants:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Soulbrain Co., Ltd.;

Inventors:

Hoyoung Kim, Hwaseong-si, KR;

Hyo-Sun Lee, Hwaseong-si, KR;

Soojin Kim, Seoul, KR;

Keonyoung Kim, Seongnam-si, KR;

Jinhye Bae, Suwon-si, KR;

Hoon Han, Anyang-si, KR;

Tae Soo Kwon, Seongnam-si, KR;

Jung Hun Lim, Seongnam-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Muir Patent Law, PLLC

Primary Examiner:

Gregory R Delcotto

Int. Cl.
CPC ...
C11D 3/04 (2006.01); C11D 3/30 (2006.01); C11D 3/44 (2006.01); H01L 21/02 (2006.01); C11D 7/26 (2006.01); C11D 7/08 (2006.01); C11D 7/32 (2006.01); C11D 11/00 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 21/304 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02068 (2013.01); C11D 7/08 (2013.01); C11D 7/261 (2013.01); C11D 7/264 (2013.01); C11D 7/266 (2013.01); C11D 7/3209 (2013.01); C11D 7/3218 (2013.01); C11D 11/0047 (2013.01); H01L 21/02057 (2013.01); H01L 21/6835 (2013.01); H01L 24/11 (2013.01); H01L 21/304 (2013.01); H01L 21/30604 (2013.01); H01L 21/30625 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/1181 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 2924/10252 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3512 (2013.01); H01L 2924/37001 (2013.01);
Abstract

Embodiments of the inventive concepts provide a method of manufacturing a semiconductor device and a cleaning composition for an adhesive layer. The method includes preparing a semiconductor substrate to which an adhesive layer adheres, removing the adhesive layer from the semiconductor substrate, and applying a cleaning composition to the semiconductor substrate to remove a residue of the adhesive layer. The cleaning composition includes a solvent including a ketone compound and having a content that is equal to or greater than 40 wt % and less thaadminn 90 wt %, quaternary ammonium salt, and primary amine.

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