The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2022
Filed:
Jun. 13, 2019
Sumitomo Electric Industries, Ltd., Osaka, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;
Autonetworks Technologies, Ltd., Yokkaichi, JP;
Kei Sakamoto, Osaka, JP;
Akiko Inoue, Osaka, JP;
Tetsuya Kuwabara, Osaka, JP;
Yusuke Oshima, Osaka, JP;
Minoru Nakamoto, Osaka, JP;
Kazuhiro Nanjo, Osaka, JP;
Taichiro Nishikawa, Osaka, JP;
Yoshihiro Nakai, Osaka, JP;
Kazuhiro Goto, Osaka, JP;
Ryo Toyoshima, Osaka, JP;
Yasuyuki Otsuka, Yokkaichi, JP;
Fumitoshi Imasato, Yokkaichi, JP;
Hiroyuki Kobayashi, Yokkaichi, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;
AutoNetworks Technologies, Ltd., Yokkaichi, JP;
Abstract
A covered electrical wire comprises a conductor and an insulating covering layer provided outside the conductor, the conductor being a stranded wire composed of a plurality of copper alloy wires composed of a copper alloy and twisted together, and has a wire diameter of 0.5 mm or less, the copper alloy containing Ni, or Ni and Fe in an amount of 0.1% by mass or more and 1.6% by mass or less in total, and P in an amount of 0.05% by mass or more and 0.7% by mass or less, with a balance being Cu and impurities, in the copper alloy, a ratio of precipitation of P to solid solution of P being 1.1 or more.