Liquid cooled memory module service device for systems with multiple memory module thicknesses and methods of using the same

Abstract

Devices and methods for adjusting the position of liquid cooling system infrastructure of a computing system comprising liquid-cooled memory modules to provide improved systems and techniques for servicing liquid-cooled memory modules are disclosed herein. According to an aspect, a device includes a table section, a handle on a first side of the table section, and a spreader section on a second side of the table section opposite from the first side, the spreader section further comprising a profile. The profile of the spreader section comprises a first pair of a flat surfaces parallel to each other, defining a first width. The profile of the spreader section further comprises a second pair of flat surfaces parallel to each other, defining a second width perpendicular to the first width, the second width being longer than the first width. The profile of the spreader section also comprises a pair of curved transition sections on opposite corners of the profile, each transition section configured to controlled adjustment with progressive incremental radius increments between an adjacent surface from each of the first pair and second pair of surfaces, such that the device is adapted to insertion with respect to a gap between cooling elements of a double-sided memory module cooling system, and is configured to be rotated to adjust the position of the cooling elements.