The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Sep. 24, 2019
Applicant:

Ihi Corporation, Tokyo, JP;

Inventors:

Akihisa Yano, Tokyo, JP;

Tatsuya Oka, Tokyo, JP;

Takahito Akita, Tokyo, JP;

Taiga Yamamoto, Tokyo, JP;

Hideshi Shibuya, Tokyo, JP;

Yusuke Takeuchi, Tokyo, JP;

Hiroyuki Kamata, Tokyo, JP;

Assignee:

IHI CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 1/00 (2006.01); F28D 9/00 (2006.01); F28D 20/00 (2006.01); F28F 3/10 (2006.01); F28F 9/26 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
F28D 9/0093 (2013.01); F28D 20/003 (2013.01); F28F 3/10 (2013.01); F28F 9/26 (2013.01); F28D 2021/0022 (2013.01);
Abstract

A heat treatment device includes first heat transfer bodies including first flow channels, second heat transfer bodies including second flow channels and each being stacked on the respective first heat transfer bodies, and a casing having a space communicating with the second flow channels and being in contact with each surface including the edge of the connection interface between each first heat transfer body and each second heat transfer body. The first heat transfer bodies each include a third flow channel provided in a wall portion isolating the first flow channels from the space of the casing. The first flow channels are grooves in contact with the connection interface, and the third flow channel is a groove in contact with the connection interface and intersecting with a virtual line connecting the first flow channels with the space of the casing at the connection interface.


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