The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Sep. 03, 2019
Applicant:

Nhk Spring Co., Ltd., Yokohama, JP;

Inventors:

Takeshi Suzuki, Yokohama, JP;

Yoshiki Ono, Yokohama, JP;

Shimpei Kurokawa, Yokohama, JP;

Kosuke Shibairi, Yokohama, JP;

Assignee:

NHK SPRING CO., LTD., Yokohama, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F16F 1/02 (2006.01); C21D 9/02 (2006.01); C22C 38/04 (2006.01); C22C 38/02 (2006.01); C21D 7/06 (2006.01); C21D 1/18 (2006.01); C22C 38/18 (2006.01); C21D 8/06 (2006.01); B24C 1/10 (2006.01);
U.S. Cl.
CPC ...
F16F 1/021 (2013.01); B24C 1/10 (2013.01); C21D 1/18 (2013.01); C21D 7/06 (2013.01); C21D 8/065 (2013.01); C21D 9/02 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/18 (2013.01); C21D 2211/001 (2013.01); C21D 2211/002 (2013.01); C21D 2211/008 (2013.01);
Abstract

A spring consists of, by mass %, 0.5 to 0.7% of C, 1.0 to 2.0% of Si, 0.1 to 1.0% of Mn, 0.1 to 1.0% of Cr, not more than 0.035% of P, not more than 0.035% of S, and the balance of Fe and inevitable impurities. The spring has a structure including not less than 65% of bainite and 4 to 13% of residual austenite by area ratio in a cross section. The spring has a compressive residual stress layer in a cross section from a surface to a depth of 0.35 mm to D/4, in which D (mm) is a circle-equivalent diameter of the cross section. The spring has a high hardness layer with greater hardness than a center portion by 50 to 500 HV from a surface to a depth of 0.05 to 0.3 mm.


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