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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11377799 B1

PDFFull Text
Date of Patent:
Jul. 05, 2022

Filed:

Feb. 18, 2021

Treatment composition containing a mold inhibiting agent and a water repellent having reduced foaming properties

Applicant:

Lonza, Llc, Morristown, NJ (US);

Inventors:

Craig Waldron, Acworth, GA (US);

Patrick Flaherty, Cumming, GA (US);

Tyler Corse, Murrieta, CA (US);

Assignee:

ARXADA, LLC, Morristown, NJ (US);

Attorney:

Dority & Manning, P.A.

Primary Examiner:

Jasper Saberi

Int. Cl.
CPC ...
D21H 21/36 (2006.01); D21H 27/32 (2006.01); D21H 27/18 (2006.01); C09D 5/16 (2006.01); B32B 13/08 (2006.01); D21H 21/12 (2006.01); A01N 25/02 (2006.01); A01N 25/04 (2006.01); A01N 55/02 (2006.01); A01N 59/16 (2006.01); B32B 29/00 (2006.01); C09D 5/00 (2006.01); C09D 5/14 (2006.01); D21H 19/12 (2006.01); D21H 21/16 (2006.01); E04C 2/04 (2006.01);
U.S. Cl.
CPC ...
D21H 21/36 (2013.01); A01N 25/02 (2013.01); A01N 25/04 (2013.01); A01N 55/02 (2013.01); A01N 59/16 (2013.01); B32B 13/08 (2013.01); B32B 29/002 (2013.01); C09D 5/00 (2013.01); C09D 5/14 (2013.01); C09D 5/1625 (2013.01); C09D 5/1687 (2013.01); D21H 19/12 (2013.01); D21H 21/12 (2013.01); D21H 21/16 (2013.01); D21H 27/18 (2013.01); D21H 27/32 (2013.01); E04C 2/043 (2013.01); B32B 2250/03 (2013.01); B32B 2255/12 (2013.01); B32B 2255/24 (2013.01); B32B 2255/26 (2013.01); B32B 2307/718 (2013.01); B32B 2307/7145 (2013.01); B32B 2307/73 (2013.01); B32B 2419/00 (2013.01);
Abstract

The present disclosure is generally directed to a mold inhibiting composition. The mold inhibiting composition can be used to treat various different substrates, including building material products, such as facing layers for wallboard. In general, any suitable paper product may be treated with the composition. The composition contains a mold inhibiting agent in combination with a defoamer. The mold inhibiting agent may comprise a pyrithione. The defoamer, on the other hand, may comprise an oil based defoamer containing metal oxide particles, such as silica particles. The mold inhibiting composition can be combined with a water repellent and applied to a substrate without excessive amounts of foam or froth being formed. The defoamer is selected so as to not interfere with the resulting water absorption properties of the product.

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