The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Dec. 06, 2019
Applicant:

Seagate Technology Llc, Cupertino, CA (US);

Inventors:

Jie Gong, Eden Prairie, MN (US);

Steven C. Riemer, Minneapolis, MN (US);

John A. Rice, Long Lake, MN (US);

Hilton Erskine, Hillman, MN (US);

Michael C. Kautzky, Eagan, MN (US);

Xuelian Xu, Eden Prairie, MN (US);

Assignee:

SEAGATE TECHNOLOGY LLC, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 3/56 (2006.01); G11B 5/187 (2006.01); C25D 5/18 (2006.01);
U.S. Cl.
CPC ...
C25D 3/562 (2013.01); C25D 5/18 (2013.01); G11B 5/187 (2013.01);
Abstract

A method includes immersing a wafer in an electrolyte including a plurality of compounds having elements of a high damping magnetic alloy with very low impurity and small uniform grain size. The method also includes applying a pulsed current with a certain range of duty cycle and pulse length to the wafer when the wafer is immersed in an electrolyte. The wafer is removed from the electrolyte when a layer of the high damping magnetic alloy is formed on the wafer.


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