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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11377726 B1

PDFFull Text
Date of Patent:
Jul. 05, 2022

Filed:

Aug. 06, 2020

Sputtering target material

Applicant:

Sanyo Special Steel Co., Ltd., Himeji, JP;

Inventors:

Hiroyuki Hasegawa, Himeji, JP;

Noriaki Matsubara, Himeji, JP;

Assignee:

Sanyo Special Steel Co., Ltd., Himeji, JP;

Attorney:

The Webb Law Firm

Primary Examiner:

John J Brayton

Int. Cl.
CPC ...
C23C 14/34 (2006.01); C22C 19/07 (2006.01); C22C 30/00 (2006.01); C22C 38/12 (2006.01); C22C 38/14 (2006.01); C22C 38/16 (2006.01); C22C 38/00 (2006.01); C22C 38/08 (2006.01); H01F 41/18 (2006.01); C22C 33/02 (2006.01); H01J 37/34 (2006.01); C22C 38/18 (2006.01); B22F 1/052 (2022.01); C22C 1/04 (2006.01); C22C 38/10 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); B22F 1/052 (2022.01); C22C 1/0433 (2013.01); C22C 19/07 (2013.01); C22C 30/00 (2013.01); C22C 33/0257 (2013.01); C22C 33/0278 (2013.01); C22C 33/0285 (2013.01); C22C 38/002 (2013.01); C22C 38/08 (2013.01); C22C 38/10 (2013.01); C22C 38/12 (2013.01); C22C 38/14 (2013.01); C22C 38/16 (2013.01); C22C 38/18 (2013.01); H01F 41/183 (2013.01); H01J 37/3426 (2013.01); B22F 2998/10 (2013.01);
Abstract

A method of making a sputtering target in which an atomized powder including, in at. %, 10 to 50% of B, 0 to 20% in total of one or more elements selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Ru, Rh, Ir, Ni, Pd, Pt, Cu, and Ag, and a balance of one or both of Co and Fe, and unavoidable impurities is provided. Fine particles are removed from the atomized powder to obtain a powder having a particle distribution where the cumulative volume of particles having a particle diameter of 5 μm or less is 10% or less, and the cumulative volume of particles having a particle diameter of 30 μm or less is 5-40%. The obtained powder is sintered to form a sputtering target comprising a sintered body. The sputtering target comprises hydrogen of 20 ppm or less.

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