The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Apr. 23, 2020
Applicants:

Lpkf Laser & Electronics Ag, Garbsen, DE;

Roman Ostholt, Langenhagen, DE;

Norbert Ambrosius, Garbsen, DE;

Inventors:

Roman Ostholt, Langenhagen, DE;

Norbert Ambrosius, Garbsen, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 15/00 (2006.01); C03C 23/00 (2006.01); B23K 26/364 (2014.01); B23K 103/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
C03C 15/00 (2013.01); B23K 26/364 (2015.10); C03C 23/0025 (2013.01); B23K 2103/54 (2018.08); B81C 1/00158 (2013.01); B81C 1/00587 (2013.01); B81C 2201/0132 (2013.01); B81C 2201/0143 (2013.01);
Abstract

A method for producing microstructures includes introducing modifications by a laser beam into a volume between two opposite outer surfaces of a glass substrate. An etching method is carried out which provides anisotropic material removal in one of the outer surfaces so as to produce recesses that have a conical shape. A layer that is resistant to an etching effect of the etching method is applied as a cover layer to only one outer surface. Then, a further etching method is carried out so that material is removed in the other outer surface until recesses of this other outer surface, which are produced and/or enlarged by the further etching method, have reached the cover layer.


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