The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

May. 12, 2017
Applicant:

Coorstek, Inc., Golden, CO (US);

Inventors:

Matthew Simpson, Evergreen, CO (US);

Ramesh Divakar, Arvada, CO (US);

Alan Filer, Longmont, CO (US);

Assignee:

CoorsTek, Inc., Golden, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); B32B 18/00 (2006.01); C04B 35/50 (2006.01); C04B 35/505 (2006.01); C04B 35/10 (2006.01); C04B 35/581 (2006.01); C23C 16/455 (2006.01); C23C 16/46 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B32B 18/00 (2013.01); C04B 35/50 (2013.01); C04B 35/505 (2013.01); C04B 35/10 (2013.01); C04B 35/581 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3224 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3244 (2013.01); C04B 2235/3847 (2013.01); C04B 2235/3865 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/5454 (2013.01); C04B 2235/604 (2013.01); C04B 2235/658 (2013.01); C04B 2235/72 (2013.01); C04B 2235/721 (2013.01); C04B 2235/77 (2013.01); C04B 2235/785 (2013.01); C04B 2235/786 (2013.01); C04B 2235/788 (2013.01); C04B 2235/80 (2013.01); C04B 2235/96 (2013.01); C04B 2235/9607 (2013.01); C04B 2235/9661 (2013.01); C04B 2235/9669 (2013.01); C04B 2235/9692 (2013.01); C04B 2237/062 (2013.01); C04B 2237/064 (2013.01); C04B 2237/122 (2013.01); C04B 2237/34 (2013.01); C04B 2237/341 (2013.01); C04B 2237/343 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/403 (2013.01); C04B 2237/567 (2013.01); C04B 2237/68 (2013.01); C04B 2237/704 (2013.01); C04B 2237/708 (2013.01); C23C 16/45565 (2013.01); C23C 16/46 (2013.01); H01J 37/3244 (2013.01); H01J 37/32477 (2013.01); H01J 37/32522 (2013.01); H01J 37/32862 (2013.01); H01J 2237/166 (2013.01); H01J 2237/334 (2013.01); H01J 2237/3341 (2013.01); H01L 21/67069 (2013.01);
Abstract

A corrosion-resistant component configured for use with a semiconductor processing reactor, the corrosion-resistant component comprising: a) a ceramic insulating substrate; and, b) a white corrosion-resistant non-porous outer layer associated with the ceramic insulating substrate, the white corrosion-resistant non-porous outer layer having a thickness of at least 50 μm, a porosity of at most 1%, and a composition comprising at least 15% by weight of a rare earth compound based on total weight of the corrosion-resistant non-porous layer; and, c) an L* value of at least 90 as measured on a planar surface of the white corrosion-resistant non-porous outer layer. Methods of making are also disclosed.


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