The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Dec. 13, 2018
Applicant:

Dowa Electronics Materials Co., Ltd., Tokyo, JP;

Inventors:

Masaya Osako, Tokyo, JP;

Taro Nakanoya, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/00 (2022.01); B22F 1/065 (2022.01); B22F 1/05 (2022.01); B22F 1/10 (2022.01);
U.S. Cl.
CPC ...
B22F 1/065 (2022.01); B22F 1/05 (2022.01); B22F 1/10 (2022.01); B22F 2301/255 (2013.01); B22F 2304/058 (2013.01); B22F 2304/10 (2013.01);
Abstract

There is provided a spherical silver powder which is capable of being sintered at a lower temperature. The spherical silver powder of spherical silver particles has cavities, each of which is formed in a corresponding one of the spherical silver particles and each of which has a major axis of 100 to 1000 nm and a minor axis of 10 nm or more, the ratio of the major axis to the minor axis (major axis/minor axis) being 5 or more, the major axis being the length of the long side of a rectangle which has a minimum area and which circumscribes the outline of a cross-section of a corresponding one of the cavities on an image of the cross-section of the corresponding one of the silver particles exposed by polishing the surface of a resin after the silver powder is embedded in the resin, and the minor axis being the length of the narrow side of the rectangle.


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