The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2022

Filed:

Apr. 03, 2018
Applicant:

The Regents of the University of California, Oakland, CA (US);

Inventors:

Sheng Xu, La Jolla, CA (US);

Yang Li, La Jolla, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/00 (2006.01); A61B 5/296 (2021.01); H05K 3/28 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 25/16 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
A61B 5/0002 (2013.01); A61B 5/296 (2021.01); H01L 21/486 (2013.01); H01L 21/56 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/03 (2013.01); H01L 24/81 (2013.01); H01L 25/162 (2013.01); H05K 3/284 (2013.01); A61B 2562/0219 (2013.01); A61B 2562/0261 (2013.01); A61B 2562/0271 (2013.01); A61B 2562/12 (2013.01); A61B 2562/164 (2013.01); H01L 2021/6024 (2013.01); H01L 2224/03003 (2013.01); H01L 2224/0311 (2013.01); H01L 2224/0569 (2013.01); H01L 2224/05551 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81815 (2013.01);
Abstract

A method of fabricating a stretchable and flexible electronic device includes forming each of the functional layers is by: (i) forming on an elastomer substrate a conductive interconnect pattern having islands interconnected by bridges; (ii) applying a conductive paste to the islands; (iii) positioning at least one functional electronic component on each island; and (iv) applying heat to cause the conductive paste to reflow. An elastomer encapsulant is formed over the functional electronic components and the conductive interconnect pattern on each of the functional layers. The elastomer encapsulant has a Young's modulus equal to or less than that of the substrate. The encapsulant includes a pigment to increase absorption of laser light. At least one via is laser ablated, which provides electrical connection to any two functional layers. The via is filled with solder paste to create a bond and electrical connection between the functional layers.


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