The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Oct. 07, 2019
Applicant:

The Diller Corporation, Cincinnati, OH (US);

Inventors:

Robert Jacob Kramer, Franklin, OH (US);

Kevin Francis O'Brien, Cincinnati, OH (US);

Assignee:

THE DILLER CORPORATION, Cincinnati, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/09 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); H05K 3/28 (2006.01); B32B 29/00 (2006.01); B32B 3/26 (2006.01); B32B 7/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); B32B 3/266 (2013.01); B32B 7/12 (2013.01); B32B 29/002 (2013.01); B32B 29/005 (2013.01); H05K 1/0353 (2013.01); H05K 1/0386 (2013.01); H05K 1/092 (2013.01); H05K 1/115 (2013.01); H05K 3/28 (2013.01); H05K 3/4038 (2013.01); H05K 3/4644 (2013.01); B32B 2250/26 (2013.01); B32B 2255/12 (2013.01); B32B 2255/205 (2013.01); B32B 2260/028 (2013.01); B32B 2260/046 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2307/4023 (2013.01); B32B 2451/00 (2013.01); B32B 2457/00 (2013.01); B32B 2457/08 (2013.01); H05K 2201/0215 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10166 (2013.01);
Abstract

A laminate having an integrated electrical component disposed within the laminate is disclosed. The laminate includes a first paper layer having at least first and second vias through the first paper layer; a first electrically-conductive layer, comprising an electrically-conductive material, disposed over a portion of the first paper layer; a second electrically-conductive layer, comprising the electrically-conductive material, disposed over another portion of the first paper layer; an electrical component disposed over the first and second electrically-conductive layers; and an insulating layer disposed over the electrical component. The first paper layer and the insulating layer encapsulate the first electrically-conductive layer, the second electrically-conductive layer, and the electrical component. The first and second vias are in electrical contact with the first electrically-conductive layer and a first terminal of the electrical component, and with the second electrically-conductive layer and a second terminal of the electrical component, respectively.


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