The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Aug. 06, 2016
Applicants:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Sumitomo Electric Printed Circuits, Inc., Koka, JP;

Sumitomo Electric Fine Polymer, Inc., Osaka, JP;

Inventors:

Yuichiro Yamanaka, Osaka, JP;

Yoshio Oka, Osaka, JP;

Satoshi Kiya, Koka, JP;

Yoshifumi Uchita, Koka, JP;

Makoto Nakabayashi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/38 (2006.01); H05K 1/03 (2006.01); B32B 15/08 (2006.01); B32B 15/088 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0346 (2013.01); B32B 15/08 (2013.01); B32B 15/088 (2013.01); H05K 3/381 (2013.01); H05K 3/389 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0355 (2013.01);
Abstract

A substrate for a printed circuit board according to an embodiment of the present invention includes a base film and a metal layer disposed on at least one of surfaces of the base film. In the substrate for a printed circuit board, an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of a surface of the base film exposed after removal of the metal layer by etching with an acidic solution, is 1 atomic % or more and 10 atomic % or less.


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