The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Jan. 17, 2020
Applicant:

Usound Gmbh, Graz, AT;

Inventors:
Assignee:

USound GmbH, Graz, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 17/00 (2006.01); B81C 1/00 (2006.01); H04R 19/00 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
H04R 17/005 (2013.01); B81C 1/00182 (2013.01); B81C 1/00865 (2013.01); H04R 19/005 (2013.01); H04R 31/00 (2013.01); H04R 2201/003 (2013.01);
Abstract

A manufacturing method for multiple MEMS sound transducers includes manufacturing a reconstructed wafer, separating multiple chips from the wafer, and encapsulating the chips in a molding material. A piezoelectric element of the particular chips is exposed to become deflectable along a stroke axis. The reconstructed wafer is connected to multiple diaphragms associated with the particular chips, wherein the diaphragms are each connected to the associated piezoelectric element so that the diaphragms are each deflectable together with the at least one associated piezoelectric element along the stroke axis. MEMS sound transducers, each of which including at least one of the chips and one of the diaphragms, are isolated. A MEMS sound transducer, which has been manufactured using the aforementioned manufacturing method, is also disclosed.


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