The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Nov. 20, 2018
Applicant:

Mitsui High-tec, Inc., Kitakyushu, JP;

Inventors:

Shigeru Saruwatari, Kitakyushu, JP;

Masayuki Ono, Kitakyushu, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02K 15/03 (2006.01); B29C 45/14 (2006.01); H02K 15/12 (2006.01); B29B 13/02 (2006.01); B29C 45/02 (2006.01); B29B 13/06 (2006.01); H02K 1/17 (2006.01); H02K 1/276 (2022.01); B29K 63/00 (2006.01); B29K 105/00 (2006.01); B29K 101/10 (2006.01);
U.S. Cl.
CPC ...
H02K 15/03 (2013.01); B29B 13/02 (2013.01); B29B 13/022 (2013.01); B29B 13/065 (2013.01); B29C 45/02 (2013.01); B29C 45/14344 (2013.01); H02K 1/17 (2013.01); H02K 1/276 (2013.01); H02K 15/12 (2013.01); B29K 2063/00 (2013.01); B29K 2101/10 (2013.01); B29K 2105/251 (2013.01);
Abstract

A method of manufacturing an core product includes heating the resin pellet at a temperature higher than 25° C. for 24 hours or longer, the resin pellet being formed of a thermosetting resin composition including epoxy resin, a curing agent, accelerator, and a release agent. The method includes holding a core body having a resin formation region, which is a region in which a resin is to be formed by injection of a melted resin, between a pair of holding members, and disposing the heated resin pellet in a resin pot formed in at least one of the pair of holding members. Additionally, the method includes melting the resin pellet in the resin pot and injecting the melted resin into the resin formation region through a resin channel extending from the resin pot in communication with the resin formation region, and curing the melted resin injected into the resin formation region.


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